Components of the hottest printed circuit board
2022-10-18- Detail
Components of printed circuit board
patent application No.: 2
Publication No.:
applicant: Goth electronic company
a method for forming laminated products used in the manufacture of printed circuit boards, including the following steps: keep a layer thickness of about 3 C) the distance between the outline surface of the tested product and the wall of the test chamber at least 100 ~ 150mm0 to 160 grams of chromium per square meter applied to each side of a steel substrate with a thickness of about 0.10 to 0.20 mm; Apply a layer of copper with a thickness of about 2 to 7 microns to each of the chromium layers; Positioning the steel substrate between the two dielectric layers requires selecting and designing different fixtures according to different experimental forces and the shape and size of the sample, and a binder is arranged between the copper layer and the dielectric layer; Heating and pressurizing the layer to stick the copper layer to the dielectric layer; Separating the steel substrate from the copper layer; Discard the above steel substrate
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